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姓名 周显良 性别:
职称 正高级工程师 学位 博士
电话 010-82998052 传真: 010-62010846
Email: zhouxl[a]mail.iggcas.ac.cn 邮编: 100029
地址 北京朝阳区北土城西路19号,中科院地质与地球物理研究所
更多信息:

English油气资源研究院重点实验室 地球物理装备技术学科组

 
简历:

  周显良,男,1957 年生于香港,中国科学院地质与地球物理研究所正高级工程师

  学历:
  • 2011.09-2013.03: 美国斯坦福大学音乐科技专业, 硕士
  • 1981.09-1987.11: 美国密歇根大学电气工程专业, 博士
  • 1980.09-1981.06: 美国密歇根大学电气工程专业, 硕士
  • 1977.09-1980.06: 香港大学电气工程专业, 学士
  简历:
  • 2014.05-现在: 中国科学院地质与地球物理研究所, 正高级工程师
  • 2013.11-现在: 香港科技大学, 兼任教授
  • 2008.07-2011.08: 美国MEMStaff, Inc.,副总裁
  • 2006.09-2008.06: 美国LV Sensors, Inc.,MEMS工程主任
  • 1992.01-2006.08: 美国Analog Devices, Inc.,技术策略经理、项目经理
  • 1987.12-1992.01: 美国Foxboro Company,主任工程师
 
学科类别:
微机电系统(MEMS)
 
研究方向:

高温高压压力传感器

 
职务:
 
社会任职:
 
承担科研项目情况:
  • 中国科学院重点部署项目子课题“高温压力传感器”
 
获奖及荣誉:
2014年 国家千人计划创新人才长期项目
 
代表论著:

会议论文/报告: 

  1. D. Lin, E. Chan, L. Lu, S. Guo, F. Zeng, Y. Zhang, M. Wong, and K. Chau, "A 1200-Atmosphere Bulk-Type All-Silicon Pressure Sensor", presented at the Transducers 2017 Conference, Kaohsiung, Taiwan, June 2017. 
  2. F. Zeng, L. Lu, Y. Zhang, S. Guo, M. Wong, and K. Chau, "MEMS Pressure Sensors for High-Temperature High-Pressure Downhole Applications", presented at the 2016 IEEE International Conference on Electron Devices and Solid-State Circuits, Hong Kong, Aug. 2016. 
  3. K. Chau, "Making MEMS Price Right for IoT," presented at the 2015 Symposium of Smart Sensor and its Application in Kitchen, Xinxing, Guangdong, Nov. 2015. 
  4. J. Weigold and K. Chau, "Evolution and Acquisition of Talent in the MEMS Industry", presented at the 2010 COMS Conference, Albuquerque, New Mexico, Aug. 2010. 
  5. T. Juneau, T. Chen, T. Brosnihan, S. Rajaraman, K. Chau, and M. Judy, "Single-Chip 1x84 MEMS Mirror Array for Optical Telecommunication Applications", presented at the 2003 SPIE Symposium on Micromachining and Microfabrication, San Jose, California, Jan. 2003. 
  6. K. Chau and B. O'Mara, "Micromachining for Optical Communication – A Technology Overview", presented at the 2001 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 2001. 
  7. K. H. L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, "An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", presented at the Transducers 1995 Conference, Stockholm, June 1995. 
  8. K. Chau, "The ADXL05 – An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", presented at the 1995 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 1995. 
  9. K. Chau, "Die Stress and Extraneous Electrostatic Effects on the ADXL50 Accelerometer", presented at the 1994 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 1994. 
  10. S. J. Sherman, W. K. Tsang, T. A. Core, R. S. Payne, D. E. Quinn, K. H. L. Chau, J. A. Farash, and S. K. Baum, "A Low Cost Monolithic Accelerometer; Product/Technology Update", presented at the 1992 IEEE International Electron Devices Meeting, San Francisco, California, Dec. 1992. 
  11. K. H. L. Chau, C. D. Fung, P. R. Harris, and G. A. Dahrooge, "A Versatile Polysilicon Diaphragm Pressure Sensor Chip", presented at the 1991 IEEE International Electron Devices Meeting, Washington D.C., Dec. 1991. 
  12. K. H. L. Chau, C. D. Fung, P. R. Harris, and J. G. Panagou, "High-Stress and Overrange Behavior of Sealed-Cavity Polysilicon Pressure Sensors", presented at the 1990 Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 1990. 
  13. H. L. Chau and K. D. Wise, "An Ultraminiature Solid-State Pressure Sensor for a Cardiovascular Catheter," presented at the Transducers 1987 Conference, Tokyo, June 1987. 
  14. H. L. Chau and K. D. Wise, "Scaling Limits in Batch-Fabricated Silicon Pressure Sensors", presented at the Transducers 1985 Conference, Philadelphia, Pennsylvania, June 1985. 

期刊论文: 

  1. K. H. L. Chau and R. E. Sulouff Jr., "Technology for the High-Volume Manufacturing of Integrated Surface-Micromachined Accelerometer Products", Microelectronics J., vol. 29, p. 579, 1998. 
  2. K. H. L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, "An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", Sensors and Actuators, vol. A54, p. 472, 1996. 
  3. K. H. L. Chau, C. D. Fung, P. R. Harris, and J. G. Panagou, "Over-Range Behavior of Sealed-Cavity Polysilicon Pressure Sensors", Sensors and Actuators, vol. A28, p. 147, 1991. 
  4. H. L. Chau and K. D. Wise, "An Ultraminiature Solid-State Pressure Sensor for a Cardiovascular Catheter", IEEE Trans. Electron Devices, vol. ED-35, p. 2355, Dec. 1988. 
  5. H. L. Chau and K. D. Wise, "Noise Due to Brownian Motion in Solid-State Pressure Sensors", IEEE Trans. Electron Devices, vol. ED-34, p. 859, Apr. 1987. 
  6. H. L. Chau and K. D. Wise, "Scaling Limits in Batch-Fabricated Silicon Pressure Sensors", IEEE Trans. Electron Devices, vol. ED-34, p. 850, Apr. 1987. 
  7. H. L. Chau and Y. C. Cheng, "Modification of Open-Circuit Voltage of Metal-Insulator-Semiconductor Solar Cells Due to a Nonuniform Insulating Layer", J. Appl. Phys., vol. 53, p. 4544, June 1982. 
  8. Y. C. Cheng and H. L. Chau, "Effects of Nonuniformity of the Insulating Layer on MIS Solar Cells", IEEE Electron Device Lett., vol. EDL-1, p. 191, Oct. 1980. 

书籍部分: 

  1. J. G. Webster (ed.), Mechanical Variables Measurement -- Solid, Fluid, and Thermal, CRC Press, 1999. Authored the section on "Pressure Measurement". 
  2. J. G. Webster (ed.), The Measurements, Instrumentation and Sensors Handbook, CRC Press, 1998. Authored the section on "Pressure Measurement". 

专利: 

  1. 张轶铭、曾凡、王文、周显良, “一种双空腔压力计芯片及其制造工艺”, China Patent Application No. CN106124117A, filed 2016. 
  2. 周显良、王文, “一种压力计芯片及其制造工艺”, China Patent Application No. CN105784214A, filed 2016. 
  3. 郭士超、周显良, “一种低应力封装MEMS芯片的结构及方法”, China Patent Application No. CN105668507A, filed 2016. 
  4. 周显良、王文, “一种MEMS压力计芯片及其制造工艺”, China Patent Application No. CN105241600A, filed 2015. 
  5. 王文、周显良, “一种MEMS应变计芯片及其制造工艺”, China Patent Application No. CN105241369A, filed 2015. 
  6. X. Zhang, M. Judy, K. H. L. Chau, N. Kuan, T. Spooner, C. Paydenkar, and P. Farrell, "Stress Mitigation in Packaged Microchips", U.S. Patent No. 8,344,487, Jan. 2013. 
  7. K. H. L. Chau, L. E. Felton, J. A. Geen, M. W. Judy, and J. R. Martin, "Capped Sensor", U.S. Patent No. 7,795,723, Sep. 2010. 
  8. K. H. L. Chau and H. R. Samuels, "Method for Calibrating Accelerometer Sensitivity", U.S. Patent No. 7,093,478, Aug. 2006. 
  9. K. H. L. Chau, R. T. Howe, R. S. Payne, Y. Zhao, T. A. Core, and S. J. Sherman, "Conductive Plane Beneath Suspended Microstructure", U.S. Patent No. 5,858,809, Jan. 1999. 
  10. K. H. L. Chau, R. T. Howe, R. S. Payne, Y. Zhao, T. A. Core, and S. J. Sherman, "Conductive Plane Beneath Suspended Microstructure", U.S. Patent No. 5,640,039, June 1997. 
  11. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Removing Sacrificial Material Through Temporary Channels as a Method of Making an Overpressure-Protected Differential Pressure Sensor", U.S. Patent No. 5,438,875, Aug. 1995. 
  12. K. H. L. Chau, M. P. Saltmarsh, and D. A. Church, "Method for Fabricating Microstructures Using Temporary Bridges", U.S. Patent No. 5,364,497, Nov. 1994. 
  13. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Overpressure-Protected, Differential Pressure Sensor", U.S. Patent No. 5,357,808, Oct. 1994. 
  14. C. D. Fung and K. H. L. Chau, "Overpressure-Protected, Polysilicon, Capacitive Differential Pressure Sensor and Method of Making Same", U.S. Patent No. 5,344,523, Sep. 1994. 
  15. C. D. Fung and K. H. L. Chau, "Overpressure-Protected, Polysilicon, Capacitive Differential Pressure Sensor and Method of Making Same", U.S. Patent No. 5,323,656, June 1994. 
  16. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Overpressure-Protected, Differential Pressure Sensor and Method of Making the Same", U.S. Patent No. 5,220,838, June 1993. 
  17. K. D. Wise and H. L. Chau, "Ultraminiature Single-Crystal Sensor with Movable Member", U.S. Patent No. 5,207,103, May 1993. 
  18. K. D. Wise and H. L. Chau, "Ultraminiature Pressure Sensor with Addressable Read-Out Circuit", U.S. Patent No. 5,113,868, May 1992. 
  19. K. D. Wise and H. L. Chau, "Method of Making an Ultraminiature Pressure Sensor", U.S. Patent No. 5,013,396, May 1991. 
  20. K. D. Wise and H. L. Chau, "Ultraminiature Pressure Sensor and Method of Making Same", U.S. Patent No. 4,881,410, Nov. 1989. 
  21. K. D. Wise and H. L. Chau, "Multipoint Pressure-Sensing Catheter System", U.S. Patent No. 4,815,472, Mar. 1989.
 

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