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Associate Professor
Professor of Engineering
Associate Senior Title
 
 
 
 
 
 
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Details of the Faculty or Staff
Name  
Kevin Hin Leung Chau
Title  
  Professor of Engineering
Highest Education  
  Ph.D.
Subject Categories  
  MEMS
Phone  
  010-82998052
Zip Code  
  100029
Fax  
  010-62010846
Email  
  zhouxl[a]mail.iggcas.ac.cn
Office  
  No.19 Beitucheng West Road, Chaoyang District, Beijing, 100029, China

Education and Appointments:

Education:

  • 2011.09-2013.03: Stanford University, M.A. in Music, Science and Technology
  • 1981.09-1987.11: University of Michigan, Ph.D. in Electrical Engineering
  • 1980.09-1981.06: University of Michigan, M.S. in Electrical Engineering
  • 1977.09-1980.06: University of Hong Kong, B.S. in Electrical Engineering

Professional Experience:

  • 2014.05-Present: Institute of Geology and Geophysics, Chinese Academy of Sciences, Professor
  • 2013.11-Present: Hong Kong University of Science and Technology, Adjunct Professor
  • 2008.07-2011.08: MEMStaff, Inc., Vice President
  • 2006.09-2008.06: LV Sensors, Inc., Director of MEMS Engineering
  • 1992.01-2006.08: Analog Devices, Inc., Technical Strategy Manager, Program Manager
  • 1987.12-1992.01: Foxboro Company, Principal Engineer

Research Interests:

Microelectromechanical Systems (MEMS), pressure sensors

Public Services:

Honors:
"State Specially Recruited Experts" under China's Thousand Talents Plan, 2014

Supported Projects:
  • Pressure Sensors for high temperature and high pressure applications

Selected Publication:

Conference Papers/Presentations: 

  1. D. Lin, E. Chan, L. Lu, S. Guo, F. Zeng, Y. Zhang, M. Wong, and K. Chau, "A 1200-Atmosphere Bulk-Type All-Silicon Pressure Sensor", presented at the Transducers 2017 Conference, Kaohsiung, Taiwan, June 2017. 
  2. F. Zeng, L. Lu, Y. Zhang, S. Guo, M. Wong, and K. Chau, "MEMS Pressure Sensors for High-Temperature High-Pressure Downhole Applications", presented at the 2016 IEEE International Conference on Electron Devices and Solid-State Circuits, Hong Kong, Aug. 2016. 
  3. K. Chau, "Making MEMS Price Right for IoT," presented at the 2015 Symposium of Smart Sensor and its Application in Kitchen, Xinxing, Guangdong, Nov. 2015. 
  4. J. Weigold and K. Chau, "Evolution and Acquisition of Talent in the MEMS Industry", presented at the 2010 COMS Conference, Albuquerque, New Mexico, Aug. 2010. 
  5. T. Juneau, T. Chen, T. Brosnihan, S. Rajaraman, K. Chau, and M. Judy, "Single-Chip 1x84 MEMS Mirror Array for Optical Telecommunication Applications", presented at the 2003 SPIE Symposium on Micromachining and Microfabrication, San Jose, California, Jan. 2003. 
  6. K. Chau and B. O'Mara, "Micromachining for Optical Communication – A Technology Overview", presented at the 2001 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 2001. 
  7. K. H. L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, "An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", presented at the Transducers 1995 Conference, Stockholm, June 1995. 
  8. K. Chau, "The ADXL05 – An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", presented at the 1995 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 1995. 
  9. K. Chau, "Die Stress and Extraneous Electrostatic Effects on the ADXL50 Accelerometer", presented at the 1994 Analog Devices General Technical Conference, Boston, Massachusetts, Apr. 1994. 
  10. S. J. Sherman, W. K. Tsang, T. A. Core, R. S. Payne, D. E. Quinn, K. H. L. Chau, J. A. Farash, and S. K. Baum, "A Low Cost Monolithic Accelerometer; Product/Technology Update", presented at the 1992 IEEE International Electron Devices Meeting, San Francisco, California, Dec. 1992. 
  11. K. H. L. Chau, C. D. Fung, P. R. Harris, and G. A. Dahrooge, "A Versatile Polysilicon Diaphragm Pressure Sensor Chip", presented at the 1991 IEEE International Electron Devices Meeting, Washington D.C., Dec. 1991. 
  12. K. H. L. Chau, C. D. Fung, P. R. Harris, and J. G. Panagou, "High-Stress and Overrange Behavior of Sealed-Cavity Polysilicon Pressure Sensors", presented at the 1990 Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 1990. 
  13. H. L. Chau and K. D. Wise, "An Ultraminiature Solid-State Pressure Sensor for a Cardiovascular Catheter," presented at the Transducers 1987 Conference, Tokyo, June 1987. 
  14. H. L. Chau and K. D. Wise, "Scaling Limits in Batch-Fabricated Silicon Pressure Sensors", presented at the Transducers 1985 Conference, Philadelphia, Pennsylvania, June 1985. 

Journal Papers: 

  1. K. H. L. Chau and R. E. Sulouff Jr., "Technology for the High-Volume Manufacturing of Integrated Surface-Micromachined Accelerometer Products", Microelectronics J., vol. 29, p. 579, 1998. 
  2. K. H. L. Chau, S. R. Lewis, Y. Zhao, R. T. Howe, S. F. Bart, and R. G. Marcheselli, "An Integrated Force-Balanced Capacitive Accelerometer for Low-G Applications", Sensors and Actuators, vol. A54, p. 472, 1996. 
  3. K. H. L. Chau, C. D. Fung, P. R. Harris, and J. G. Panagou, "Over-Range Behavior of Sealed-Cavity Polysilicon Pressure Sensors", Sensors and Actuators, vol. A28, p. 147, 1991. 
  4. H. L. Chau and K. D. Wise, "An Ultraminiature Solid-State Pressure Sensor for a Cardiovascular Catheter", IEEE Trans. Electron Devices, vol. ED-35, p. 2355, Dec. 1988. 
  5. H. L. Chau and K. D. Wise, "Noise Due to Brownian Motion in Solid-State Pressure Sensors", IEEE Trans. Electron Devices, vol. ED-34, p. 859, Apr. 1987. 
  6. H. L. Chau and K. D. Wise, "Scaling Limits in Batch-Fabricated Silicon Pressure Sensors", IEEE Trans. Electron Devices, vol. ED-34, p. 850, Apr. 1987. 
  7. H. L. Chau and Y. C. Cheng, "Modification of Open-Circuit Voltage of Metal-Insulator-Semiconductor Solar Cells Due to a Nonuniform Insulating Layer", J. Appl. Phys., vol. 53, p. 4544, June 1982. 
  8. Y. C. Cheng and H. L. Chau, "Effects of Nonuniformity of the Insulating Layer on MIS Solar Cells", IEEE Electron Device Lett., vol. EDL-1, p. 191, Oct. 1980. 

Book Sections: 

  1. J. G. Webster (ed.), Mechanical Variables Measurement -- Solid, Fluid, and Thermal, CRC Press, 1999. Authored the section on "Pressure Measurement". 
  2. J. G. Webster (ed.), The Measurements, Instrumentation and Sensors Handbook, CRC Press, 1998. Authored the section on "Pressure Measurement". 

Patents: 

  1. 张轶铭、曾凡、王文、周显良, “一种双空腔压力计芯片及其制造工艺”, China Patent Application No. CN106124117A, filed 2016. 
  2. 周显良、王文, “一种压力计芯片及其制造工艺”, China Patent Application No. CN105784214A, filed 2016. 
  3. 郭士超、周显良, “一种低应力封装MEMS芯片的结构及方法”, China Patent Application No. CN105668507A, filed 2016. 
  4. 周显良、王文, “一种MEMS压力计芯片及其制造工艺”, China Patent Application No. CN105241600A, filed 2015. 
  5. 王文、周显良, “一种MEMS应变计芯片及其制造工艺”, China Patent Application No. CN105241369A, filed 2015. 
  6. X. Zhang, M. Judy, K. H. L. Chau, N. Kuan, T. Spooner, C. Paydenkar, and P. Farrell, "Stress Mitigation in Packaged Microchips", U.S. Patent No. 8,344,487, Jan. 2013. 
  7. K. H. L. Chau, L. E. Felton, J. A. Geen, M. W. Judy, and J. R. Martin, "Capped Sensor", U.S. Patent No. 7,795,723, Sep. 2010. 
  8. K. H. L. Chau and H. R. Samuels, "Method for Calibrating Accelerometer Sensitivity", U.S. Patent No. 7,093,478, Aug. 2006. 
  9. K. H. L. Chau, R. T. Howe, R. S. Payne, Y. Zhao, T. A. Core, and S. J. Sherman, "Conductive Plane Beneath Suspended Microstructure", U.S. Patent No. 5,858,809, Jan. 1999. 
  10. K. H. L. Chau, R. T. Howe, R. S. Payne, Y. Zhao, T. A. Core, and S. J. Sherman, "Conductive Plane Beneath Suspended Microstructure", U.S. Patent No. 5,640,039, June 1997. 
  11. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Removing Sacrificial Material Through Temporary Channels as a Method of Making an Overpressure-Protected Differential Pressure Sensor", U.S. Patent No. 5,438,875, Aug. 1995. 
  12. K. H. L. Chau, M. P. Saltmarsh, and D. A. Church, "Method for Fabricating Microstructures Using Temporary Bridges", U.S. Patent No. 5,364,497, Nov. 1994. 
  13. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Overpressure-Protected, Differential Pressure Sensor", U.S. Patent No. 5,357,808, Oct. 1994. 
  14. C. D. Fung and K. H. L. Chau, "Overpressure-Protected, Polysilicon, Capacitive Differential Pressure Sensor and Method of Making Same", U.S. Patent No. 5,344,523, Sep. 1994. 
  15. C. D. Fung and K. H. L. Chau, "Overpressure-Protected, Polysilicon, Capacitive Differential Pressure Sensor and Method of Making Same", U.S. Patent No. 5,323,656, June 1994. 
  16. C. D. Fung, K. H. L. Chau, P. R. Harris, J. G. Panagou, and G. A. Dahrooge, "Overpressure-Protected, Differential Pressure Sensor and Method of Making the Same", U.S. Patent No. 5,220,838, June 1993. 
  17. K. D. Wise and H. L. Chau, "Ultraminiature Single-Crystal Sensor with Movable Member", U.S. Patent No. 5,207,103, May 1993. 
  18. K. D. Wise and H. L. Chau, "Ultraminiature Pressure Sensor with Addressable Read-Out Circuit", U.S. Patent No. 5,113,868, May 1992. 
  19. K. D. Wise and H. L. Chau, "Method of Making an Ultraminiature Pressure Sensor", U.S. Patent No. 5,013,396, May 1991. 
  20. K. D. Wise and H. L. Chau, "Ultraminiature Pressure Sensor and Method of Making Same", U.S. Patent No. 4,881,410, Nov. 1989. 
  21. K. D. Wise and H. L. Chau, "Multipoint Pressure-Sensing Catheter System", U.S. Patent No. 4,815,472, Mar. 1989.
 
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